Printed Circuit Board (PCB)

Surface treatment

Electroless Gold Nickel (ENIG)

The finish is composed of two layers placed through a chemical process: a nickel layer and a gold layer.

Gold gives the final coating and nickel is used to prevent gold from migrating to copper.

This finish withstands several soldering cycles and long periods of storage.

  • Automatic or manual vertical lines
  • Electrolytic process or non-electrolytic process (ENIG).

CONTACT

C/Sarobe nº 4. Pol. Ind. Abendaño.
20800 Zarautz (Guipúzcoa). SPAIN
T: +34 943 10 42 56
F: +34 943 84 70 88
E: maquinaria@lmp-lumiplas.com