Printed Circuit Board (PCB)

Surface treatment

OSP (Organic Surface Preservative)

This process involves protecting the exposed copper with a layer of organic substances, achieving a uniform and flat surface result.

CONTACT

C/Sarobe nº 4. Pol. Ind. Abendaño.
20800 Zarautz (Guipúzcoa). SPAIN
T: +34 943 10 42 56
F: +34 943 84 70 88
E: maquinaria@lmp-lumiplas.com