Printed Circuit Board (PCB)

Surface treatment

Blackoxide and Bond processes

It is the process used to encourage the adhesion of the inner layers during the pressing process. It is also used for the outer layers. These are the processes that we use: MEC-Etch-Bond, Alpha-Prep, Cirubond, Multibond etc

CONTACT

C/Sarobe nº 4. Pol. Ind. Abendaño.
20800 Zarautz (Guipúzcoa). SPAIN
T: +34 943 10 42 56
F: +34 943 84 70 88
E: maquinaria@lmp-lumiplas.com